2003ISO9001: 2000 certified. Established Suzhou factory.
2004Vertical Continuous Copper Plating Equipment (VCP) went into mass production.
2005Successfully introduced via filling process into HDI, BGA, PBGA, FLIP CHIP and CSP, etc. on Vertical Continuous Copper Plating Equipment (VCP).
2006Established 2nd factory in order to expand productivity.
2007Built up Double Track Vertical Continuous Copper Plating Equipment (DVCP) and went into mass production.
2008Completion of new Suzhou factory with area of 15,000M2
2009Successfully developed Reel to Reel Vertical Continuous Copper Plating Equipment (RVCP) specially for flexible panel. Pass new ISO9001 2008 certification
2010Expanded Dong Long factory with area of 7,200M2
2011Successfully developed and sold U-turn Vertical Continuous Copper Plating Equipment (UVCP) using frame and 6 axis robot for automatic loading specially for extra thin board and fine lines pattern applying to process of CSP and FLIP CHIP, etc.
2012Successfully developed Vertical Continuous Copper Plating Equipment (Double type) (VCP(DT)) using robot with 6 axis robot for automatic loading, double the capacity of VCP.
2013The sales of UVCP is 20% of total sales volume.
2014Successfully developed Standard Vertical Continuous Copper Plating Equipment (SVCP) and went into mass production.
2015SVCP machine is applied for process of car PCB.