- Panel size : Frame with one fixed size
- Board thickness : 0.046 ~ 0.8 mm
- Line speed : 0.2 ~ 0.7 m/min (adjustable)
- Plating window : 610 x 5280 mm/Chamber
- Current density : 30 ASF (max.) for DC Rectifier
- Anode : Insoluble anode (Ti mesh with IrO2 coating)
- Cathode : Single track continuous transportation
U-turn Vertical Continuous Copper Plating Equipment (UVCP)
Its design is specially for FC BGA, CSP, FC CSP, SAP and MSAP, etc. It can be linked with Sn plating. Loading system coordinated with 6 axis robot and CCD to detect panel edges for accurate loading. Fixed frame is to assist production and avoid contacting patterns. It gets remarkable performance for throwing power of high aspect ratio for via filling, through hole filing plating on extra fine pattern of thin board.
Products application:
PCB of 3C products, CPU of computer, GPU chip and Substrate-Like PCB, SLP, etc.
Products application:
PCB of 3C products, CPU of computer, GPU chip and Substrate-Like PCB, SLP, etc.