PRODUCTS

  1. HOME
  2. PRODUCTS
  3. CONTINUOUS TYPE EQUIPMENT
CONTINUOUS TYPE EQUIPMENT

Standard Vertical Continuous Copper Plating Equipment (SVCP)

This machine is applied for process of panel plating without auxiliary frame and jig for running board thickness 0.134 to 2.0 mm during production. Standardized design may lower the cost, shorten delivery time. It gets remarkable performance for throwing power of high aspect ratio for through hole, blind via and via filling plating.
Products application:
Class A:
Auto load/unload with insoluble anode
Panel plating on MB PCB, automotive board, HDI through/blind/via filling.
Class B:
Auto load/unload with soluble anode
Panel plating on MB PCB, automotive board, HDI through/blind via plating.
Class C:
Manual load/unload with soluble anode
Flexible panel with frame for through/blind via plating.
DETAIL
  • Panel size:  24” x 24” (Max.); 16” x 14” (Min.) (Standard)
                        32” x 24” (Max.); 24”x 14” (Min.) (Option)
  • Board thickness: 0.134~ 2.0 mm (Max.)
  • Line speed: 0.4 ~ 1.5 m/min (adjustable)
  • Plating window: 610(810) x 5280 mm/Chamber
  • Current density: 30ASF (Max.) with soluble anode or
                               40ASF (Max.) with insoluble anode
  • Anode: Soluble copper ball in Ti basket
  • Insoluble anode (Ti mesh with IrO2 coating)
  • Cathode: Vertical clamping system
BACK