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CONTINUOUS TYPE EQUIPMENT

Vertical Continuous Copper Plating Equipment (Double Type) (VCP-DT)

It’s suitable for PCB of panel plating, pattern plating. Double track design will increase double capacity more than VCP but engage less floor space. It has remarkable performance of throwing power for processes of through hole, blind via, via filling and through hole filling plating.
Products application:
PCB of 3C products (HDI, Substrate-Like PCB, SLP of MP), automotive board, IC substrate (FC CSP, FC BGA, flexible panel (FPC), etc).
DETAIL
  • Panel size: 24” x 24” (Max.); 16” x 14” (Min.) (Standard)
                       32” x 24” (Max.); 24” x 14” (Min.) (Option)
  • Board thickness: 0.06 ~ 2.0 mm                   
  • Line speed: 0.3 ~ 1.2 m/min (adjustable)
  • Plating window: 610(810) x 4800 mm/Chamber
  • Current density: 40 ASF (Max.) for DC Rectifier 
                               80 ASF (Max.) for PPR Rectifier
  • Anode: Insoluble anode (Ti mesh with IrO2 coating )
  • Cathode: Double Tracks vertical clamping system
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