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CONTINUOUS TYPE EQUIPMENT

Horizontal Continuous Copper Plating Equipment (HCP)

This machine is applied for process of panel plating. It’s designed high current density and high efficiency of plating. It gets remarkable performance for throwing power of high aspect ratio for through hole and blind via.
Products application:
PCB of 3C products (HDI), automotive board
DETAIL
  • Panel size: 24” x 24” (Max.); 16” x 14” (Min.)
  • Board thickness: 0.134 ~ 2.0 mm
  • Line speed: 0.5 ~ 1.5 m/min (adjustable)
  • Plating window: 610 x 4800 mm/Chamber
  • Current density: 40 ASF (Max.) for DC Rectifier
                                80 ASF (Max.) for PPR Rectifier
  • Anode: Insoluble anode (Ti mesh with IrO2 coating )
  • Cathode: Horizontal clamping system
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